Assembly and Mfg. Pros: SMTA — Upper Midwest Expo & Tech Forum – June 22nd, 2017

The Midwest Expo & Tech Forum is setting the record straight by enlisting industry heavyweights to speak on topics including soldering, redefining web algorithms for smarter browsers, and how buyers can avoid mistakes when purchasing high-dollar x-ray systems.

Join the event for free technical sessions, free lunch, and access to hundreds of movers-and-shakers in the electronics assembly and manufacturing industry.

The event is hosted by the Surface Mount Technology Association (SMTA), an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including micro-systems, emerging technologies, and related business operations.

What: Upper Midwest Expo & Tech Forum
Where: DoubleTree by Hilton Minneapolis – Park Place
Address: Park Ballroom, 1500 Park Place Blvd. — Minneapolis, MN 55416

Event Listing:

8:00AM Registration

9:00AM Expo Opens


Evaluate the Implications of Finer Mesh Solder Powder on Solder Paste Performance with AIM Solder’s Tim O’Neill

9:00AM – 10:00AM
Benefits and Implications of Finer Mesh Solder Powder
Speaker: Tim O’Neill, AIM Solder

“The trend for smaller devices with more functionality is accelerating as evidenced by the proliferation of wearables. From the Apple Watch™ to body cameras for law enforcement, the demands and opportunities are only limited by our imagination. The capability of existing PCB assembly technology needs to advance rapidly to meet the mission profile of these new devices. For the solder paste manufacturer, this path inevitably leads to incorporating finer metal powder into solder paste to facilitate ultra-fine pitch printing.”

How Can We Build Netflix-like or Amazon-like Systems Which Recommend Experiences in the Physical World?

Real Life Recommendation Engine
Speaker: Patrick Delaney, Lab651

“Now as we stand at the precipice of a new movement – one governed by smaller devices, newer and revolutionary sensors, gateways and connected devices of all sorts, we are faced with a completely new level of value proposition: how can we build Netflix-like or Amazon-like systems which recommend experiences in the physical world.”

Avoiding Mistakes When Acquiring X-ray Inspection Capabilities

1:30PM – 2:30PM
2D, 2.5D, and 3D X-Ray Inspection – What’s a “D”?
Speaker: Bill Cardoso, Ph.D, Creative Electron

“The goal of this presentation is to give the audience the tools needed to avoid making mistakes when acquiring x-ray inspection capabilities. We will set the record straight and clearly define critical concepts in x-ray inspection. The different x-ray modalities, 2D, 2.5D, and 3D x-ray inspection will be explained in details at the user level – no math involved. Most importantly, this presentation will cover when each modality must be utilized for a successful quality assurance program. A rich set of images and videos will be used to illustrate the advantages and disadvantages of each x-ray inspection modality.”

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Mitch Walleser

Mitch Walleser

Mitch works with manufacturing engineers and product specialists to examine new technology and products. His background includes 3D printing, electronics and cleanroom manufacturing. Stay up to date with new insights on automated production solutions by following on Twitter. @Go_to_PAC

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